FFKs / Fast-Setting Tile Adhesive with Enhanced Properties

Details:

• Suitable for tiling on wooden surfaces, thermal walls, fireplaces, drywall, old tiles, and on SAKRET OAD waterproofing
• For ceramic and stoneware tiles, stone finish slabs, fireplace tiles, clinker tiles, and slabs
• Used for facade tile adhesive in insulation systems
• Can be applied in thin and medium layers
• Usable on heated floors
• Ideal for quick professional work!
• Service temperature range: -25°C to +80°C
• Resistant to freeze and moisture
• Available in gray

Application:

Surface Preparation:

• The substrate must be dry and solid; all cracks and voids should be filled.
• Clean the substrate of any loose or easily removable layers.
• For particularly dense and/or smooth surfaces, roughen them up.
• Prime the surface with SAKRET UG primer (diluted at a ratio of 1:3). For very smooth concrete surfaces, use SAKRET QG primer.

Usage:

• Mix SAKRET FFK in a clean container with cold water until a homogeneous, lump-free mixture is achieved.
• It is recommended to use a mixer at 600 RPM.
• After a resting time of approximately 3 minutes, remix the adhesive.
• In one application, cover an area that can be tiled within about 10 minutes.
• Do not fill expansion joints with tile adhesive.
• Avoid tiling in direct sunlight, drafts, or on damp surfaces.
• Cured tile adhesive can only be removed mechanically.

Instructions:

• The technical data refers to a temperature of +20°C and 50% relative humidity. Lower temperatures increase, and higher temperatures decrease the specified values.
• Protect the adhesive during the curing phase from sunlight, drafts, frost, and excessively high temperatures (>25°C).
• Contains cement; reacts alkaline.
• Protect skin and eyes, and follow technical instructions. If the mixture comes into contact with eyes, rinse with plenty of water and seek medical attention if necessary.
• Protect the packaging from weather conditions, store on wooden pallets in a cool, dry place, and immediately cover any opened packaging.